Showing 31 - 40 of 40, total 4 pages [ First] [ Previous] [Next] [Last] |
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31 | | | 2 layers half hole pcbs
Specification: Layer: 2 Materials: ,FR-4 PCB thickness: 1.0¡À0.1mm Final copper:
Detail: Layer: 2 Materials: ,FR-4 PCB thickness: 1.0¡À0.1mm Final copper: 1 oz
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32 | | | plated gold pcbs
Specification: Layer: up to 30 layers Material: FR4, FR1, CAM1, 22F TG: 130-170
Detail: Layer: up to 30 layers Material: FR4, FR1, CAM1, 22F TG: 130-170 Surface: HASL, ENIG, OSP
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33 | | | gold finger pcbs
Specification: Layer: 4 L Material: FR4, TG170 PCB thickness: 1.6mm+/-8%
Detail: Layer: 4 L Material: FR4, TG170 PCB thickness: 1.6mm+/-8%
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34 | | | gold finger pcbs
Specification: Layer: 4 L Material: FR4, TG170 PCB thickness: 1.6mm+/-8%
Detail: Layer: 4 L Material: FR4, TG170 PCB thickness: 1.6mm+/-8%
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35 | | | immersion gold board
Specification: Layer: 4layer Material: FR4 Thickness: 1.6mm
Detail: High quality immersion gold finish PCB assembly
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36 | | | flexible circuit boards
Specification: FPC cable, flexible circuit boards
Detail: FPC cable, flexible circuit boards PCBA application: industrial Assembly process: SMD
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37 | | | flexible pcbs with enig and gold fi
Specification: Double-Layered
Detail: Double-Layered Flexible PCBs With ENIG And Gold Finger
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38 | | | 2-layer polyimide flex pcb
Specification: 2-Layer
Detail: Types: 2 layers flex PCB Thickness: Minimum thickness 0.06mm
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39 | | | blue soldermask with enig pcb
Specification: Material: FR-4 Layers: 2/4/6/8/10/12L
Detail: Material: FR-4 Layers: 2/4/6/8/10/12L Finishing thickness: 0.4-3.0mm
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40 | | | bluetooth module rigid-flex-pcb
Specification: 6 layers Rigid-flex
Detail: Layers: 6 layers Rigid-flex material: PI+FR4
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